Micro & Nano Fabrication

Quantum X Align enhances Nanoscribe’s field-proven 3D Microfabrication technology based on Two-Photon Polymerisation (2PP) by adding high-precision alignment capabilities for highly accurate placement of printed structures. Print freeform micro-optics directly onto optical fibres or photonic chips with submicron accuracy using this highest resolution 3D printer with nano-precision aligned 3D printing capabilities. Produce efficient optical interconnects for photonic integration and photonic packaging or miniaturised imaging optics, e.g. for minimally invasive endoscopy.

Nanoscribe’s Quantum X Shape is a truly capable multi-talent. Based on Two-Photon Polymerisation (2PP), the 3D laser lithography system combines proprietary 3D printing technologies that make it the optimal tool for rapid prototyping and wafer-scale batch processing of virtually any 2.5D and 3D shape with submicron precision and accuracy.

Quantum X Bio from Nanoscribe is an exceptionally capable, versatile bioprinter with highest resolution. The direct laser writing based 3D bioprinter offers essential features such as precise temperature control, sterile environment and functionalised biomaterials that unlock a new level of bioprinting and effectively accelerate innovation in key applications such as tissue engineering, cell biology and the full range of biomedical applications.

The world’s first Two-Photon Grayscale Lithography (2GL) system combines the extraordinary performance of grayscale lithography with the precision and flexibility of Nanoscribe’s pioneering Two-Photon Polymerisation (2PP) technology. Quantum X, as maskless lithography system, is the optimal tool for industrial manufacturing of 2.5D freeform micro-optics, microlens arrays and multi-level diffractive optical elements.

Nanoscribe IP Resins are established standard materials for high-resolution microfabrication. Sub-micrometre resolution and shape accuracy as well as easy handling are key features of these negative-tone resins. IP Resins are highly-efficient printing materials and an essential element of Nanoscribe’s Microfabrication Solution Sets. The printer software offers advanced recipes optimised for different photoresins and applications. They make the 3D printing workflow straightforward and speed up the design iteration cycles for scientific and industrial use cases ranging from biomimetic surfaces, micro-optical elements to mechanical metamaterials and 3D cell scaffolds.

TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimise any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements.

The SC-1 from Swiss Cluster is a ground-breaking and high-performing cluster equipment that combines Atomic Layer Deposition (ALD) with Physical Vapor Deposition (PVD) in an extremely compact, modular, and fully automated system for high-throughput production of multinanolayered coatings from the ALD and PVD materials library.

The TFS 500 is ideal for diverse use in thin film coating applications. Being the first Beneq reactor model, has proven its case as a versatile tool for both in-depth ALD research and robust batch processing. The TFS 500 is an ideal tool for multi-project environments.

The SC Qube is an ALD batch system for R&D and small scale production to coat different kinds and sizes of 3D parts. The patent-pending scalable chamber from Swiss Cluster can be configured to fit to all types of 3D parts and coating material requirements to deliver exceptional coating homogeneity at unparalleled process speeds.

The SC Optima Series from Swiss Cluster is the next generation of large batch systems for Atomic Layer Deposition (ALD). The SC Optima has been carefully optimised to deliver high-quality and uniform coatings to all types of 3D objects in record time, streamlining every step of your door-to door processes, from loading to unloading.